Thermal design of hot plate for 300-mm wafer heating in post-exposure bake | |
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Publication Year | 2011 |
Journal Name | Microelectronic Engineering |
Volume Number | 88 |
Page Number | 3195–3198 |
Author | Jinho Lee, Hyun Goo Kwon, Sangwoo Shin, Sangjo Han, Jungik Ha, Hosun Yoo, Hyung Hee Cho |